Originally posted on Data Center POST.

As AI and high‑performance computing (HPC) workloads strain traditional air‑cooled data centers, Sabey Data Centers is expanding its partnership with JetCool Technologies to make direct‑to‑chip liquid cooling a standard option across its U.S. portfolio. The move signals how multi‑tenant operators are shifting from experimental deployments to programmatic strategies for high‑density, energy‑efficient infrastructure.

Sabey, one of the largest privately held multi‑tenant data center providers in the United States, first teamed with JetCool in 2023 to test direct‑to‑chip cooling in production environments. Those early deployments reported 13.5% server power savings compared with air‑cooled alternatives, while supporting dense AI and HPC racks without heavy reliance on traditional mechanical systems.

The new phase of the collaboration is less about proving the technology and more about scale. Sabey and JetCool are now working to simplify how customers adopt liquid cooling by turning what had been bespoke engineering work into repeatable designs that can be deployed across multiple sites. The goal is to give enterprises and cloud platforms a predictable path to high‑density infrastructure that balances performance, efficiency and operational risk.

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