Bob Shine to Present About Optical Interconnects and Integrated Photonics for AI, Machine Learning and HPC Applications
Irvine, California – July 2, 2024 – Telescent, a leading manufacturer of automated fiber cross-connects for network and data center operators, is excited to announce that Bob Shine, Vice President of Marketing and Product Management, is an invited speaker at the prestigious IEEE Summer Topical Meeting Series. The conference is scheduled to take place July 15-17, 2024, in Bridgetown, Barbados.
Shine will participate in a panel titled “OIIP: Optical Interconnects and Integrated Photonics for AI/ML/HPC Applications.” This session will dive into the latest advancements and the future potential of optical technologies in accelerating artificial intelligence, machine learning, and high-performance computing. As a recognized leader with extensive experience in optical networking, Shine’s insights are eagerly anticipated.
“Telescent is at the forefront of transforming optical interconnect technologies that are critical for the next generation of AI and computing technologies,” said Bob Shine, VP of Marketing and Product Management at Telescent. “I am honored to share our vision along with others on the panel and work with peers and pioneers in the field at this important gathering.”
The IEEE Summer Topical Meeting Series is renowned for bringing together experts from the global scientific and engineering communities to discuss new ideas, breakthroughs, and challenges faced in the fields of optics and photonics.
Attendees of the conference can expect to gain invaluable insights into how integrated photonics are driving innovation across multiple high-impact sectors. Shine’s presentation will highlight Telescent’s ongoing commitment to advancing these technologies through their groundbreaking solutions.
For more information on the IEEE Summer Topical Meeting Series, visit https://www.ieee-sum.org.
For more information about Telescent and their innovative system, visit: www.telescent.com.
About Telescent
Telescent Inc’s. large-scale, low-loss, robotic patch-panel solution brings automation to the fiber layer of optical networks. Telescent’s all-optical, latched connection approach ensures optimal performance and reliability while enabling software control for remote reconfigurations and diagnostics. Network and data center operators can enjoy the advantages of automation with Telescent’s new RobUSTTM system design, providing the flexibility to scale the system on a pay-as-you-go basis as their networks expand.
Automation of the fiber layer reduces operating expenses and manual errors while creating new service opportunities for multi-tenant and hyperscale data center operators as well as telecom service providers. To learn more about Telescent, including any recent product updates, please visit www.telescent.com.
For more information, visit https://www.ofcconference.org/en-us/home/about.
Media Contact:
Ilissa Miller
iMiller Public Relations
Tel: 1.914.315.6424
Email: telescent@imillerpr.com
